Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors

In this paper we report on the optimization of the SiNchi:H insulator, deposited by the electron cyclotron resonance (ECR) plasma method, as a dielectric for metal-insulator-semiconductor (MIS) structures built on an InP compound semiconductor. Two different MIS structures have been obtained in whic...

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Authors: Redondo, E.; Martil De La Plaza, Ignacio; González Díaz, Germán; Fernández Sánchez, Paloma; Cimas Cuevas, María Rosa
Format: Article
Publication date:2002
Country:España
Institution:Universidad Complutense de Madrid (UCM)
Repository:Docta Complutense
Language:English
OAI Identifier:oai:docta.ucm.es:20.500.14352/59103
Online Access:https://hdl.handle.net/20.500.14352/59103
Access Level:Open access
Keyword:537
Level Transient Spectroscopy
Chemical-Vapor-Deposition
Electrical-Properties
Devices
InP.
Electricidad
Electrónica (Física)
2202.03 Electricidad
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author Redondo, E.
author2 Martil De La Plaza, Ignacio
González Díaz, Germán
Fernández Sánchez, Paloma
Cimas Cuevas, María Rosa
author2_role author
author
author
author
author_browse Cimas Cuevas, María Rosa
Fernández Sánchez, Paloma
González Díaz, Germán
Martil De La Plaza, Ignacio
Redondo, E.
author_facet Redondo, E.
Martil De La Plaza, Ignacio
González Díaz, Germán
Fernández Sánchez, Paloma
Cimas Cuevas, María Rosa
author_role author
collection Docta Complutense
description In this paper we report on the optimization of the SiNchi:H insulator, deposited by the electron cyclotron resonance (ECR) plasma method, as a dielectric for metal-insulator-semiconductor (MIS) structures built on an InP compound semiconductor. Two different MIS structures have been obtained in which the minimum of the interface trap density (D-it,D-min) at the insulator/InP interface attains values of device quality. In the first structure, a Al/SiN1.5:H/SiN1.6:H/InP dual-layer insulator was obtained and optimized after rapid thermal annealing treatment at 500 degreesC for 30s. After this treatment, the value of D-it,D-min was 9 x 10(11) cm(-2) eV(-1). In the second structure, the MIS structure was Al/SiN1.6:H/InP single-layer insulator, in which the InP surface was exposed to an N-2 plasma prior to the SiN1.6:H film deposition. In this case, the value of D-it.min was 1.6 x 10(12) cm(-2) eV(-1). Both types of structures were used as gate insulators on N-channel enhanced-mode MIS field-effect transistor test devices. From the dc output characteristics of the transistors, we obtain values for the electron channel mobility in the range 1550-1600 cm(-2) V-1 s(-1). This is a confirmation of the great potential of the ECR plasma method as a simple way to obtain device quality gate structures on InP without the use of passivation processes of the InP surface prior to the deposition of the gate dielectric, thus simplifying the whole device fabrication procedure.
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oai_identifier_str oai:docta.ucm.es:20.500.14352/59103
publishDate 2002
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reponame_str Docta Complutense
spelling Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors Redondo, E. Martil De La Plaza, Ignacio González Díaz, Germán Fernández Sánchez, Paloma Cimas Cuevas, María Rosa 537 Level Transient Spectroscopy Chemical-Vapor-Deposition Electrical-Properties Devices InP. Electricidad Electrónica (Física) 2202.03 Electricidad In this paper we report on the optimization of the SiNchi:H insulator, deposited by the electron cyclotron resonance (ECR) plasma method, as a dielectric for metal-insulator-semiconductor (MIS) structures built on an InP compound semiconductor. Two different MIS structures have been obtained in which the minimum of the interface trap density (D-it,D-min) at the insulator/InP interface attains values of device quality. In the first structure, a Al/SiN1.5:H/SiN1.6:H/InP dual-layer insulator was obtained and optimized after rapid thermal annealing treatment at 500 degreesC for 30s. After this treatment, the value of D-it,D-min was 9 x 10(11) cm(-2) eV(-1). In the second structure, the MIS structure was Al/SiN1.6:H/InP single-layer insulator, in which the InP surface was exposed to an N-2 plasma prior to the SiN1.6:H film deposition. In this case, the value of D-it.min was 1.6 x 10(12) cm(-2) eV(-1). Both types of structures were used as gate insulators on N-channel enhanced-mode MIS field-effect transistor test devices. From the dc output characteristics of the transistors, we obtain values for the electron channel mobility in the range 1550-1600 cm(-2) V-1 s(-1). This is a confirmation of the great potential of the ECR plasma method as a simple way to obtain device quality gate structures on InP without the use of passivation processes of the InP surface prior to the deposition of the gate dielectric, thus simplifying the whole device fabrication procedure. Iop Publishing Ltd https://hdl.handle.net/20.500.14352/59103
spellingShingle Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
Redondo, E.
537
Level Transient Spectroscopy
Chemical-Vapor-Deposition
Electrical-Properties
Devices
InP.
Electricidad
Electrónica (Física)
2202.03 Electricidad
title Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
title_full Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
title_fullStr Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
title_full_unstemmed Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
title_short Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
title_sort Improvement of SiNx : H/InP gate structures for the fabrication of metal-insulator-semiconductor field-effect transistors
topic 537
Level Transient Spectroscopy
Chemical-Vapor-Deposition
Electrical-Properties
Devices
InP.
Electricidad
Electrónica (Física)
2202.03 Electricidad
topic_facet 537
Level Transient Spectroscopy
Chemical-Vapor-Deposition
Electrical-Properties
Devices
InP.
Electricidad
Electrónica (Física)
2202.03 Electricidad
url https://hdl.handle.net/20.500.14352/59103